YCS Maintenance Home 杨长顺维修家
Qualcomm reballing stencil- Snapdragon 460/662-SH4250/6115

Specification

Sold inpcs
Product lineBGA Reballing Stencils
Chinese name植锡台高通网-骁龙460/662-SH4250/6115
PriceOn request — quoted per order quantity

About this part

Qualcomm reballing stencil- Snapdragon 460/662-SH4250/6115. Part of the BGA Reballing Stencils range.

BGA Reballing Stencils

Qualcomm reballing stencil- Snapdragon 460/662-SH4250/6115

植锡台高通网-骁龙460/662-SH4250/6115

Minimum order
On request
Price
On request
Send the whole list for pricing

We reply with unit price, packing and lead time within one working day. Instruments can be shipped as a single sample first.

14-month warranty on instruments we manufacture
Express, air or sea freight with tracking
Spare parts and firmware kept for the life of the model
Questions about this part? info@ycsmobiletools.com

Others in this line

See all BGA Reballing Stencils