Specification

Sold in	pcs
Product line	BGA Reballing Stencils
Chinese name	植锡台高通网-骁龙865小/870小 -SM8250 102小
Price	On request — quoted per order quantity

About this part

Qualcomm reballing stencil - Snapdragon 865 small /870 small -SM8250 102 small. Part of the BGA Reballing Stencils range.

BGA Reballing Stencils

Name: Qualcomm reballing stencil - Snapdragon 865 small /870 small -SM8250 102 small
Brand: YCS
SKU: yc-0605
Availability: InStock

植锡台高通网-骁龙865小/870小 -SM8250 102小

We reply with unit price, packing and lead time within one working day. Instruments can be shipped as a single sample first.

14-month warranty on instruments we manufacture

Express, air or sea freight with tracking

Spare parts and firmware kept for the life of the model

Questions about this part? info@ycsmobiletools.com