YCS CPU magnet reballing platform
Y9140204004
Specification
| Sold in | pcs |
|---|---|
| Product line | BGA Reballing Stencils |
| Chinese name | 植锡台高通网-骁龙8Gen5-SM8850 |
| Price | On request — quoted per order quantity |
About this part
Qualcomm reballing stencil- Snapdragon 8Gen5-SM8850. Part of the BGA Reballing Stencils range.
BGA Reballing Stencils
Qualcomm reballing stencil- Snapdragon 8Gen5-SM8850
植锡台高通网-骁龙8Gen5-SM8850
- Minimum order
- On request
- Price
- On request
Send the whole list for pricing
We reply with unit price, packing and lead time within one working day. Instruments can be shipped as a single sample first.
14-month warranty on instruments we manufacture
Express, air or sea freight with tracking
Spare parts and firmware kept for the life of the model
Questions about this part? info@ycsmobiletools.com
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